Processing with Lasers

Laser Processing is a very well established technology that is used in a large range of applications. In fact 2015 is the 50th anniversary of the first industrial laser. Industries such as Medical and Industrial manufacturing facilities use lasers. Wire Processing has well defined processing methods: measure to length, cut and marking of wire, wire stripping, crimping terminals, assembling to a wire harness and electrical testing. A number of other methods are also deployed such as Ultrasonic Splicing and Heat Shrink Tube Processing. The laser as a technology in wire processing supports applications that cannot be done with a traditional wire stripping or marking method. In these cases, contact processing of wire (blades, hot impression onto insulation) runs a risk of damage to the insulation or conductors. This is very critical in mission critical applications such as medical and aerospace. A wire harness or wire lead is a component of a larger assembly which can include enclosures and connection to other electrical devices and electronics such as printed circuit boards. Even these assemblies have application possibilities with lasers. In this posting we will demonstrate some of these applications.

Wire Stripping

Lasers are used in applications such as Teflon coated twisted pair cable, where contact with a blade risks nicking the insulation on the inner conductors or the braided shield.

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Marking and Engraving

A laser can be used to apply a mark to a number of materials including metal and plastic.  By adjusting the focal point of the laser, a mark can be applied to the surface or engrave deep into the surface of the material being marked.

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IC Decapsulation

Lasers can be used in IC Decapsulation to remove layers of material to inspect the chip’s underlying circuits.

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Laser cutting is a common application in manufacturing.  A laser can cut materials to length as well as complex assemblies with many cuts or holes as illustrated below.

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Laser welding is used in a number of applications including jewelry. Lasers provide localized heat with short cycle time to minimize distortion of surrounding materials

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TJ Curtis Technologies Inc and our WireProcess Specialties Division provide solutions to companies who manufacture a large range of products. We are constantly looking for ways to help our customers improve their productivity and reduce processing costs. Connect Your Way today to begin.

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